REDWOOD CITY, CA — (Marketwired) — 04/30/13 — , a provider of and emerging commerce solutions, will be participating in the 13th conference taking place in Dubai, United Arab Emirates from May 14-15, 2013. A Gold Sponsor of the event, i2c will highlight the power of its global payment and commerce platform through an interactive experience at its exhibition stand. Conference delegates will also have the opportunity to listen to i2c executives Amir Wain, chief executive officer, and Jim Ackerson, senior vice president, speak on the topics of mobile & digital commerce and payment processing in the cloud.
The mobile commerce demonstration i2c will orchestrate is designed to showcase how payments, mobile and loyalty can converge to create richer consumer experiences. Delegates may participate by downloading a mobile wallet app at and visiting the i2c stand (N10) to obtain a digital coupon linked to a payment card. The coupon can be redeemed by simply using the card as payment at multiple merchants located within the Dubai World Trade Centre.
i2c executives will also be sharing their thought leadership with delegates at two conference sessions:
“How mobile and digital are shaping the future of commerce”
Tuesday, May 14, 2013 at 11:00
Presenters: Amir Wain, Chief Executive Officer, i2c and Richard Bialek, Director, Prepaid Products, Visa CEMEA
“Innovating prepaid with cloud technology”
Wednesday, May 15, 2013 at 14:30
Presenter: Jim Ackerson, Senior Vice President, i2c
i2c, Inc. provides the cloud-based infrastructure financial institutions, corporations, brands and governments need to launch and profitably manage payment and next-generation commerce products. Its global-ready platform encompasses card-based, virtual and mobile payments, loyalty and back office solutions. Headquartered in Silicon Valley, California, i2c supports clients on five continents from six sales and support offices worldwide. Visit for more information.
Melissa Telli
Director of Marketing and Communications
i2c, Inc.
Telephone: +1 650-593-5400
E-mail: